发明申请
US20160280857A1 COMPOSITIONS, COMPOSITES PREPARED THEREFROM, AND FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME
有权
组合物，其制备的复合材料，以及包括其的膜和膜和电子器件
- 专利标题： COMPOSITIONS, COMPOSITES PREPARED THEREFROM, AND FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME
- 专利标题（中）： 组合物，其制备的复合材料，以及包括其的膜和膜和电子器件
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申请号： US15081468申请日： 2016-03-25
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公开(公告)号： US20160280857A1公开(公告)日： 2016-09-29
- 发明人: Hyunjeong JEON , Min Sang KIM , Sang Soo JEE , Byunghee SOHN
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 优先权： KR10-2015-0043489 20150327; KR10-2016-0034556 20160323
- 主分类号： C08G73/10
- IPC分类号： C08G73/10
摘要：
A composition including a polyamic acid modified with an alkoxysilane group; and an oligo silica compound, wherein the polyamic acid modified with an alkoxysilane group includes a reaction product of (i) a condensation reaction product of an acid anhydride and a diamine, and (ii) a reactive organosilane compound, wherein the oligo silica compound includes a condensation reaction product of an organosilane diol and a an alkoxysilane compound, wherein an amount of silicon atoms in the composition is less than or equal to about 15 wt % based on a total weight of solid contents in the composition.