发明申请
- 专利标题: THIN-FILM DEPOSITION METHODS WITH THERMAL MANAGEMENT OF EVAPORATION SOURCES
- 专利标题(中): 薄膜沉积方法与蒸发源的热管理
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申请号: US15078605申请日: 2016-03-23
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公开(公告)号: US20160281211A1公开(公告)日: 2016-09-29
- 发明人: Markus Eberhard Beck , Ulrich Alexander Bonne
- 申请人: Siva Power, Inc.
- 主分类号: C23C14/24
- IPC分类号: C23C14/24
摘要:
In various embodiments, evaporation sources for deposition processes have disposed therearound an insulation material configurable to fit snugly around the source body of the evaporation source and to be at least partially distanced away from the source body to expedite heat transfer therefrom.
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