发明申请
US20160281211A1 THIN-FILM DEPOSITION METHODS WITH THERMAL MANAGEMENT OF EVAPORATION SOURCES 审中-公开
薄膜沉积方法与蒸发源的热管理

  • 专利标题: THIN-FILM DEPOSITION METHODS WITH THERMAL MANAGEMENT OF EVAPORATION SOURCES
  • 专利标题(中): 薄膜沉积方法与蒸发源的热管理
  • 申请号: US15078605
    申请日: 2016-03-23
  • 公开(公告)号: US20160281211A1
    公开(公告)日: 2016-09-29
  • 发明人: Markus Eberhard BeckUlrich Alexander Bonne
  • 申请人: Siva Power, Inc.
  • 主分类号: C23C14/24
  • IPC分类号: C23C14/24
THIN-FILM DEPOSITION METHODS WITH THERMAL MANAGEMENT OF EVAPORATION SOURCES
摘要:
In various embodiments, evaporation sources for deposition processes have disposed therearound an insulation material configurable to fit snugly around the source body of the evaporation source and to be at least partially distanced away from the source body to expedite heat transfer therefrom.
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