Invention Application
US20160290691A1 PIPING STRUCTURE, COOLING DEVICE INCLUDING THE SAME, AND METHOD FOR TRANSPORTING REFRIGERANT VAPOR
审中-公开
管路结构,包括其的冷却装置以及运输制冷剂蒸汽的方法
- Patent Title: PIPING STRUCTURE, COOLING DEVICE INCLUDING THE SAME, AND METHOD FOR TRANSPORTING REFRIGERANT VAPOR
- Patent Title (中): 管路结构,包括其的冷却装置以及运输制冷剂蒸汽的方法
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Application No.: US15036688Application Date: 2014-11-10
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Publication No.: US20160290691A1Publication Date: 2016-10-06
- Inventor: Masaki CHIBA , Minoru YOSHIKAWA , Akira SHOUJIGUCHI , Kenichi INABA , Arihiro MATSUNAGA , Masanori SATO , Tadao HOSAKA , Yasuhito NAKAMURA
- Applicant: NEC CORPORATION , NEC PLATFORMS , LTD.
- Priority: JP2013-235565 20131114
- International Application: PCT/JP2014/005637 WO 20141110
- Main IPC: F25B41/00
- IPC: F25B41/00

Abstract:
It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage.
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