Invention Application
- Patent Title: MODULATOR WITH SIGNAL ELECTRODE ENCLOSED BY GROUND ELECTRODE
- Patent Title (中): 带有接地电极的信号电极的调制器
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Application No.: US15091224Application Date: 2016-04-05
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Publication No.: US20160291353A1Publication Date: 2016-10-06
- Inventor: Gregory J. MCBRIEN , Karl KISSA
- Applicant: Lumentum Operations LLC
- Main IPC: G02F1/025
- IPC: G02F1/025 ; G02F1/01

Abstract:
A modulator may include a substrate. The modulator may include one or more waveguides formed upon or formed in the substrate. A signal electrode may be provided adjacent to at least one of the one or more waveguides and may include a curved outer surface. The modulator may include one or more ground electrodes provided adjacent to the signal electrode. Each ground electrode, of the one or more ground electrodes, may include a respective curved inner surface that is radially spaced from the curved outer surface of the signal electrode. The one or more ground electrodes and the substrate may at least substantially enclose the curved outer surface of the signal electrode.
Public/Granted literature
- US09964784B2 Modulator with signal electrode enclosed by ground electrode Public/Granted day:2018-05-08
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