发明申请
- 专利标题： CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- 专利标题（中）： 导电基板及其制造方法
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申请号： US14442605申请日： 2013-12-02
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公开(公告)号： US20160291709A1公开(公告)日： 2016-10-06
- 发明人: Ji Young HWANG , Jiehyun SEONG
- 申请人： LG CHEM, LTD.
- 优先权： KR10-2012-0138371 20121130
- 国际申请： PCT/KR2013/011073 WO 20131202
- 主分类号： G06F3/041
- IPC分类号： G06F3/041
摘要：
A method for preparing a conducting substrate according to the present invention comprises: 1) forming a conducting pattern on a substrate; 2) forming a first darkening layer in at least a partial area on the conducting pattern by performing electroplating; and 3) forming a second darkening layer in at least a partial area on the conducting pattern by dipping the conducting pattern in an oxidizer solution.
公开/授权文献
- US09715289B2 Method for manufacturing a conducting substrate 公开/授权日：2017-07-25