Invention Application
- Patent Title: EARSET
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Application No.: US14837332Application Date: 2015-08-27
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Publication No.: US20160302000A1Publication Date: 2016-10-13
- Inventor: Doo Sik SHIN
- Applicant: Haebora Co., Ltd.
- Assignee: Haebora Co., Ltd.
- Current Assignee: Haebora Co., Ltd.
- Priority: KR10-2015-0050805 20150410
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/08

Abstract:
Disclosed is an earset. The earset includes: a case that forms an appearance thereof; an ear pad that is mounted in an end portion of the case, forms a communication hole communicating with a user's external auditory canal, and is attached to/detached from a user's ears; and a soundproof housing that is received in the case, and includes a speaker output hole for transmitting sound generated from a speaker to the communication hole of the ear pad, a microphone input hole for transmitting the sound transmitted from the user's ears to the communication hole of the ear pad to a microphone, a speaker accommodating groove for accommodating the speaker while communicating with the speaker output hole, a microphone accommodating groove for accommodating the microphone while communicating with the microphone input hole, and one or more back holes for allowing a part of sound flowing into the microphone input hole to flow into a rear surface of the microphone accommodated in the microphone accommodating groove while communicating with the microphone input hole.
Public/Granted literature
- US09762989B2 Earset Public/Granted day:2017-09-12
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