Invention Application
- Patent Title: CONDUCTIVE MICRO-CHANNEL STRUCTURE
- Patent Title (中): 导电微通道结构
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Application No.: US14695148Application Date: 2015-04-24
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Publication No.: US20160311704A1Publication Date: 2016-10-27
- Inventor: Ronald Steven Cok
- Applicant: Eastman Kodak Company
- Main IPC: C02F1/46
- IPC: C02F1/46

Abstract:
A conductive micro-channel structure includes a layer having layer edges and an electrode having first and second portions formed in or under the layer. One or more fluid micro-channels are formed in the layer, expose the first portion of the electrode, and extend to a layer edge to form a fluid port. A conductor micro-channel includes a solid conductor in the conductor micro-channel. The solid conductor is electrically conductive, is electrically connected to the second portion of the electrode, and extends from the second portion to a layer edge to form a conductor port.
Public/Granted literature
- US09695067B2 Conductive micro-channel structure Public/Granted day:2017-07-04
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