Invention Application
US20160311704A1 CONDUCTIVE MICRO-CHANNEL STRUCTURE 有权
导电微通道结构

  • Patent Title: CONDUCTIVE MICRO-CHANNEL STRUCTURE
  • Patent Title (中): 导电微通道结构
  • Application No.: US14695148
    Application Date: 2015-04-24
  • Publication No.: US20160311704A1
    Publication Date: 2016-10-27
  • Inventor: Ronald Steven Cok
  • Applicant: Eastman Kodak Company
  • Main IPC: C02F1/46
  • IPC: C02F1/46
CONDUCTIVE MICRO-CHANNEL STRUCTURE
Abstract:
A conductive micro-channel structure includes a layer having layer edges and an electrode having first and second portions formed in or under the layer. One or more fluid micro-channels are formed in the layer, expose the first portion of the electrode, and extend to a layer edge to form a fluid port. A conductor micro-channel includes a solid conductor in the conductor micro-channel. The solid conductor is electrically conductive, is electrically connected to the second portion of the electrode, and extends from the second portion to a layer edge to form a conductor port.
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