Invention Application
US20160318277A1 ARTICLES WITH LAMINATION TRANSFER FILMS HAVING ENGINEERED VOIDS
审中-公开
具有带工程化声音的层压传输膜的文章
- Patent Title: ARTICLES WITH LAMINATION TRANSFER FILMS HAVING ENGINEERED VOIDS
- Patent Title (中): 具有带工程化声音的层压传输膜的文章
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Application No.: US15206757Application Date: 2016-07-11
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Publication No.: US20160318277A1Publication Date: 2016-11-03
- Inventor: Evan L. Schwartz , Justin P. Meyer , Olester Benson, JR. , Terry O. Collier , Michael Benton Free , Robert F. Kamrath , Mieczyslaw H. Mazurek , David B. Olson , K. Raveesh Shenoy , Martin B. Wolk
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Main IPC: B32B3/26
- IPC: B32B3/26 ; H01L51/52 ; B32B27/30 ; H01L51/00
Abstract:
Transfer films, articles made therewith, and methods of making and using transfer films to form bridged nanostructures are disclosed.
Public/Granted literature
- US09731473B2 Articles with lamination transfer films having engineered voids Public/Granted day:2017-08-15
Information query
