A thermoelectric module with high efficiency is provided. The thermoelectric module may include a first substrate including a plurality of first electrodes, a second substrate provided opposite the first substrate and including a plurality of second electrodes, a plurality of thermoelectric devices provided between the first substrate and the second substrate and electrically connected to the first electrodes and the second electrodes, and a wire connection hole configured to penetrate through at least one of the first substrate and the second substrate and expose a portion of at least one surface of the first electrodes and the second electrodes.