Invention Application
US20160323486A1 IMAGING MODULE, MANUFACTURING METHOD OF IMAGING MODULE, AND ELECTRONIC DEVICE
审中-公开
成像模块,成像模块的制造方法和电子设备
- Patent Title: IMAGING MODULE, MANUFACTURING METHOD OF IMAGING MODULE, AND ELECTRONIC DEVICE
- Patent Title (中): 成像模块,成像模块的制造方法和电子设备
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Application No.: US15205191Application Date: 2016-07-08
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Publication No.: US20160323486A1Publication Date: 2016-11-03
- Inventor: Yoshiyuki TAKASE , Kiyoto SATO , Tatsuya FUJINAMI
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2014-002450 20140109
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146 ; G02B27/64 ; H04N5/357 ; G02B7/08

Abstract:
An imaging module 100 includes a lens unit 10 which has a lens group 12, and an imaging element unit 20 which is fixed to the lens unit 10 and has an imaging element 27 which images a subject through the lens group 12. The lens unit 10 has a lens drive unit 16, and a flexible substrate 13 which includes a wiring group 13a which is electrically connected to the lens drive unit 16. The imaging element unit 20 has a wiring connection portion 24 which is electrically connected to the wiring group 13a included in the flexible substrate 13. The flexible substrate 13 has a portion of which a width in an arrangement direction of wires of the wiring group 13a is narrower than a width of an end portion on a side connected to the wiring connection portion 24.
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