Invention Application
- Patent Title: HOT GAS PATH COMPONENT HAVING NEAR WALL COOLING FEATURES
- Patent Title (中): 具有近壁式冷却功能的热气路径组件
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Application No.: US14739849Application Date: 2015-06-15
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Publication No.: US20160363054A1Publication Date: 2016-12-15
- Inventor: Carlos Miguel Miranda , Srikanth Chandrudu Kottilingam , Benjamin Paul Lacy
- Applicant: General Electric Company
- Main IPC: F02C7/18
- IPC: F02C7/18 ; B23P15/04

Abstract:
A method for providing micro-channels in a hot gas path component includes forming a first micro-channel in an exterior surface of a substrate of the hot gas path component. A second micro-channel is formed in the exterior surface of the hot gas path component such that it is separated from the first micro-channel by a surface gap having a first width. The method also includes disposing a braze sheet onto the exterior surface of the hot gas path component such that the braze sheet covers at least of portion of the first and second micro-channels, and heating the braze sheet to bond it to at least a portion of the exterior surface of the hot gas path component.
Public/Granted literature
- US09828915B2 Hot gas path component having near wall cooling features Public/Granted day:2017-11-28
Information query
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