Invention Application
- Patent Title: METHODS FOR IN-PLANE STRAIN MEASUREMENT OF A SUBSTRATE
- Patent Title (中): 基板的面内应变测量方法
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Application No.: US15154959Application Date: 2016-05-14
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Publication No.: US20160363492A1Publication Date: 2016-12-15
- Inventor: Hongbin Yu , Hanqing Jiang , Hanshuang Liang , Teng Ma
- Applicant: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
- Main IPC: G01L1/24
- IPC: G01L1/24

Abstract:
Methods for measuring and/or mapping in-plane strain of a surface of a substrate. A grating is formed on at least a portion of the surface of the substrate. A laser is then used focused onto the grating to determine the strain on the surface by determining the variation of the grating wavelength due to the strain on the surface. The strain information is essentially carried by the grating, in terms of grating wavelength, because it varies according to the volume change of the underlying substrates. By scanning the surface grating with the small laser size, a high resolution strain map of the surface can be produced. The induced strain is related to the grating wavelength variation, which leads to the diffraction angle variation that is captured by the strain sensing measurements.
Public/Granted literature
- US10139295B2 Methods for in-plane strain measurement of a substrate Public/Granted day:2018-11-27
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