Invention Application
US20160365300A1 Coolant Distribution Structure For Monolithic Microwave Integrated Circuits (MMICs)
有权
单片微波集成电路(MMIC)的冷却液分配结构
- Patent Title: Coolant Distribution Structure For Monolithic Microwave Integrated Circuits (MMICs)
- Patent Title (中): 单片微波集成电路(MMIC)的冷却液分配结构
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Application No.: US14734372Application Date: 2015-06-09
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Publication No.: US20160365300A1Publication Date: 2016-12-15
- Inventor: Anurag Gupta , David H. Altman , Jason G. Milne , Christopher R. Koontz
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L23/373 ; H01L23/367 ; H01L23/66

Abstract:
A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the passthrough layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.
Public/Granted literature
- US09502330B1 Coolant distribution structure for monolithic microwave integrated circuits (MMICs) Public/Granted day:2016-11-22
Information query
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