Invention Application
US20160372414A1 INTEGRATED CIRCUITS HAVING REDUCED DIMENSIONS BETWEEN COMPONENTS
有权
在组件之间具有减小尺寸的集成电路
- Patent Title: INTEGRATED CIRCUITS HAVING REDUCED DIMENSIONS BETWEEN COMPONENTS
- Patent Title (中): 在组件之间具有减小尺寸的集成电路
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Application No.: US14744912Application Date: 2015-06-19
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Publication No.: US20160372414A1Publication Date: 2016-12-22
- Inventor: Stanley Seungchul Song , Choh Fei Yeap , Da Yang
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L27/088 ; H01L21/8234

Abstract:
In a particular aspect, an integrated circuit includes a first transistor including a first source region and a first drain region. The integrated circuit includes a second transistor including a second source region and a second drain region. The integrated circuit includes a first gate structure coupled to the first transistor and to the second transistor. The first gate structure is included in a first layer. The integrated circuit further includes a first metal line coupled to the first source region and to the second drain region. The first metal line has a two-dimensional routing arrangement and is included in a second layer that is distinct from the first layer.
Public/Granted literature
- US09859210B2 Integrated circuits having reduced dimensions between components Public/Granted day:2018-01-02
Information query
IPC分类: