Invention Application
- Patent Title: METHOD FOR FORMING PAD OF WAFER
- Patent Title (中): 形成垫片的方法
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Application No.: US14902085Application Date: 2014-04-30
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Publication No.: US20160372512A1Publication Date: 2016-12-22
- Inventor: Heui Gyun AHN
- Applicant: SILICONFILE TECHNOLOGIES INC.
- Priority: KR10-2013-0079549 20130708
- International Application: PCT/KR2014/003828 WO 20140430
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/683
Abstract:
The present invention relates to a technology for simply performing a process of forming a pad on the rear surface of a via hole in a packing process in a process of forming a pad of a wafer. The present invention is characterized by a packing process in a process for manufacturing a wafer, the packing process comprising the steps of: attaching glass to the upper portion of a micro lens and then separating a handling wafer from an element wafer, thereby exposing metal layers formed on the element wafer to the outside; and forming pads for the metal layers.
Information query
IPC分类:
