Invention Application
US20160379920A1 APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
审中-公开
集成电路封装中的无线连接的装置，系统和方法
- Patent Title: APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
- Patent Title (中): 集成电路封装中的无线连接的装置，系统和方法
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Application No.: US15195310Application Date: 2016-06-28
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Publication No.: US20160379920A1Publication Date: 2016-12-29
- Inventor: Jiamiao Tang , Henry Xu , Shinichi Sakamoto
- Applicant: Intel Corporation
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L21/50 ; H01L25/065 ; H01L21/56
Abstract:
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die, The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
Public/Granted literature
- US09837340B2 Apparatus, system, and method for wireless connection in integrated circuit packages Public/Granted day:2017-12-05
Information query
IPC分类:
