Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
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Application No.: US15263304Application Date: 2016-09-12
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Publication No.: US20160379940A1Publication Date: 2016-12-29
- Inventor: Thorsten MEYER
- Applicant: Intel Corporation
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L21/56 ; H01L21/54
Abstract:
This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip, wherein the molded body comprises an array of molded structure elements, and first solder elements engaged with the molded structure elements.
Information query
IPC分类:
