发明申请
- 专利标题： Thermal Compression Bonding Approaches for Foil-Based Metallization of Solar Cells
- 专利标题（中）： 太阳能电池箔基金属化的热压缩粘合方法
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申请号： US14752830申请日： 2015-06-26
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公开(公告)号： US20160380128A1公开(公告)日： 2016-12-29
- 发明人: Richard Hamilton Sewell
- 申请人： Richard Hamilton Sewell
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224 ; H01L31/18
摘要：
Thermal compression bonding approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes placing a metal foil over a metalized surface of a wafer of the solar cell. The method also includes locating the metal foil with the metalized surface of the wafer. The method also includes, subsequent to the locating, applying a force to the metal foil such that a shear force appears between the metal foil and the metallized surface of the wafer to electrically connect a substantial portion of the metal foil with the metalized surface of the wafer.
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