Invention Application
US20170004946A1 Conductive Composite and Circuit Protection Device Including a Conductive Composite
审中-公开
导电复合材料和电路保护装置包括导电复合材料
- Patent Title: Conductive Composite and Circuit Protection Device Including a Conductive Composite
- Patent Title (中): 导电复合材料和电路保护装置包括导电复合材料
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Application No.: US14788530Application Date: 2015-06-30
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Publication No.: US20170004946A1Publication Date: 2017-01-05
- Inventor: Edward W. Rutter, JR. , Ann O. Banich , Jaydip Das , Chun-Kwan Tsang , Kavitha Bharadwaj , Ting Gao , Jianhua Chen , James Toth
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01H85/055
- IPC: H01H85/055

Abstract:
Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.
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