Invention Application
- Patent Title: PROTECTIVE FILM-FORMING FILM, SHEET FOR FORMING PROTECTIVE FILM, COMPLEX SHEET FOR FORMING PROTECTIVE FILM, AND METHOD OF PRODUCING MANUFACTURED PRODUCT
- Patent Title (中): 保护膜形成用保护膜，用于形成保护膜的复合片，以及生产制造产品的方法
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Application No.: US15113561Application Date: 2015-01-21
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Publication No.: US20170004991A1Publication Date: 2017-01-05
- Inventor: Daisuke Yamamoto , Hiroyuki Yoneyama
- Applicant: LINTEC CORPORATION
- Priority: JP2014-009242 20140122
- International Application: PCT/JP2015/051566 WO 20150121
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/56 ; H01L21/78 ; H01L21/268 ; C09J7/02 ; C09J133/10
Abstract:
Provided is protective film-forming sheet (2) including: a protective film-forming film (1) having a light transmittance at a wavelength of 1064 nm of 55% or greater and a light transmittance at a wavelength of 550 nm of 20% or less; and a release sheet (21) which is laminated on one or both faces of the protective film-forming film (1). According to this protective film-forming sheet (2), it is possible to form a protective film which allows a workpiece such as a semiconductor wafer to have a modified layer disposed in advance therein by a laser so that the workpiece can be split through the application of force thereon, while preventing grinding marks on the workpiece or a product formed therefrom from being visible to the naked eye.
Public/Granted literature
Information query
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