Invention Application
- Patent Title: THREE-DIMENSIONAL MOUNTING METHOD AND THREE-DIMENSIONAL MOUNTING DEVICE
- Patent Title (中): 三维安装方法和三维安装设备
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Application No.: US15038963Application Date: 2014-11-19
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Publication No.: US20170005068A1Publication Date: 2017-01-05
- Inventor: Koji NISHIMURA , Katsumi TERADA , Mikio KAWAKAMI
- Applicant: TORAY ENGINEERING CO., LTD.
- Priority: JP2013-244496 20131127
- International Application: PCT/JP2014/080610 WO 20141119
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/00 ; H01L25/065

Abstract:
A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material.
Public/Granted literature
- US09673166B2 Three-dimensional mounting method and three-dimensional mounting device Public/Granted day:2017-06-06
Information query
IPC分类: