Invention Application
- Patent Title: FORMING APPARATUS AND FORMING METHOD USING THE SAME
- Patent Title (中): 形成装置和形成方法
-
Application No.: US15193448Application Date: 2016-06-27
-
Publication No.: US20170008791A1Publication Date: 2017-01-12
- Inventor: Yong Ha KIM , Kyoung San KIM , Jung Kyu PARK , Sung Chan UH , Dae Ung YEOM , Seung Hwan JUNG , Won Seok CHUNG , Hyeon Cheol JEONG , Young Kyong JO , Hong Ick CHAE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0098282 20150710
- Main IPC: C03B11/12
- IPC: C03B11/12 ; C03B11/04 ; C03B11/08

Abstract:
Provided are a forming apparatus for forming a part of a flat panel-shaped glass in a curved surface by selectively heating only a formation part, and a forming method using the same. The forming apparatus includes a transfer device configured to transfer material having a flat panel shape and a curved surface forming device configured to form at least one part of the material in a curved surface, wherein the curved surface forming device includes a forming mold on which the material is seated, a heating unit configured to heat the at least one part of the material by laser light, and a jig unit configured to form the at least one part of the material heated by laser light in a curved surface.
Information query