Invention Application
- Patent Title: WATERPROOF HOUSING
- Patent Title (中): 防水外壳
-
Application No.: US14792664Application Date: 2015-07-07
-
Publication No.: US20170013101A1Publication Date: 2017-01-12
- Inventor: MING-SHAN CHEN , SHIH-FU YU , CHIH-PIN LIN , CHIH-HAO HSU
- Applicant: ICHIA TECHNOLOGIES,INC.
- Main IPC: H04M1/18
- IPC: H04M1/18

Abstract:
A waterproof housing without any screwing structure includes a top waterproof module, a waterproof gasket disposed on the top waterproof module, and a bottom waterproof module detachably combined with the top waterproof module. The top waterproof module has a top case, a transparent plate, and a resilient film. The top case has a touch-control window and a fingerprint hole, the transparent plate is fixed on the inner surface of the top case and entirely shields the touch-control window, and the resilient film is fixed between the inner surface of the top case and the transparent plate to shield the fingerprint hole. When a smart phone is received in the waterproof housing, the resilient film can be pressed to trigger the fingerprint function of the smart phone. The top and bottom waterproof modules are combined with each other to compress the waterproof gasket.
Information query