Invention Application
- Patent Title: ELECTRICALLY CONNECTING ELECTRICALLY ISOLATED PRINTHEAD DIE GROUND NETWORKS AT FLEXIBLE CIRCUIT
- Patent Title (中): 电气连接电气隔离开关电源网络在柔性电路
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Application No.: US15275916Application Date: 2016-09-26
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Publication No.: US20170015099A1Publication Date: 2017-01-19
- Inventor: Kevin Bruce , Gregory N. Burton , Joseph M. Torgerson
- Applicant: Hewlett-Packard Development Company, L.P.
- Main IPC: B41J2/14
- IPC: B41J2/14
Abstract:
A printhead assembly for an inkjet-printing device includes a printhead die and a flexible circuit connected to the printhead die. The printhead die includes a substrate, a first ground network electrically connected to the substrate, a device layer, and a second ground network electrically connected to the device layer. The first ground network and the second ground network are electrically isolated from one another within the printhead die. The first ground network and the second ground network are electrically connected to one another at the flexible circuit.
Public/Granted literature
- US10272679B2 Electrically connecting electrically isolated printhead die ground networks at flexible circuit Public/Granted day:2019-04-30
Information query
IPC分类:
