Invention Application
- Patent Title: COMMUNICATION MODULE ASSEMBLY
- Patent Title (中): 通信模块总成
-
Application No.: US14411483Application Date: 2014-04-15
-
Publication No.: US20170018876A1Publication Date: 2017-01-19
- Inventor: Dong Won LEE , So Yeon WON
- Applicant: SOLID, INC.
- Applicant Address: KR Gyeonggi-do
- Assignee: SOLID, INC.
- Current Assignee: SOLID, INC.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2014-0011801 20140408
- International Application: PCT/KR2014/003265 WO 20140415
- Main IPC: H01R13/631
- IPC: H01R13/631
Abstract:
The present invention relates to a communication module assembly. The present invention is a communication module assembly which is electrically connected to a communication device and is supplied with power and signal, and can include a connection port unit that is supplied with the power and the signal from the communication device; a cable connection portion which is provided in the connection port unit, and to which cables electrically connected to the communication device is connected; a plurality of communication modules that is stacked on and connected to the connection port unit in a plug-in type; and a guide means for guiding the communication module such that the communication modules are connected to the connection port unit in a central direction.
Public/Granted literature
- US09793650B2 Communication module assembly Public/Granted day:2017-10-17
Information query
