Invention Application
- Patent Title: SEAMLESS LINKING OF MULTIPLE AUDIO SIGNALS
- Patent Title (中): 无缝链接多个音频信号
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Application No.: US14805656Application Date: 2015-07-22
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Publication No.: US20170024183A1Publication Date: 2017-01-26
- Inventor: Junsong Li , John Allen
- Applicant: Silicon Laboratories Inc.
- Main IPC: G06F3/16
- IPC: G06F3/16

Abstract:
In one embodiment, an apparatus includes: a first demodulator to demodulate a digital signal into a first demodulated audio signal; a second demodulator to demodulate an analog signal into a second demodulated audio signal, the first and second demodulated audio signals including common content; and a delay determination circuit to determine a delay value between the common content of the two demodulated audio signals based at least in part on a first delay estimate having a first resolution and a second delay estimate having a second resolution.
Public/Granted literature
- US09893823B2 Seamless linking of multiple audio signals Public/Granted day:2018-02-13
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