Invention Application
- Patent Title: PACKAGING MATERIAL FOR ELECTRICAL STORAGE DEVICES, ELECTRICAL STORAGE DEVICE, AND METHOD FOR PRODUCING EMBOSSED PACKAGING MATERIAL
- Patent Title (中): 电气储存装置用包装材料,电气储存装置及生产包装材料的方法
-
Application No.: US15286375Application Date: 2016-10-05
-
Publication No.: US20170025647A1Publication Date: 2017-01-26
- Inventor: Tomoaki TANIGUCHI
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2014-080363 20140409
- Main IPC: H01M2/02
- IPC: H01M2/02 ; H01M10/058 ; H01M2/06 ; H01M10/0525

Abstract:
A packaging material for electrical storage devices which includes a base layer, a metal foil layer arranged on the base layer, and a sealant layer arranged on the metal foil layer. In the packaging material for electrical storage devices, the base layer includes at least one of a stretched polyester resin and a stretched polyamide resin, and the metal foil layer is an aluminum foil containing iron in the range of about 0.5 mass % or more to about 5.0 mass % or less. The packaging material has a tensile elongation of about 50% or more both the MD and TD directions of the base layer.
Public/Granted literature
Information query