发明申请
- 专利标题： Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
- 专利标题（中）： 载体铜箔，层压板，制造印刷线路板的方法和制造电子装置的方法
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申请号： US15218466申请日： 2016-07-25
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公开(公告)号： US20170032978A1公开(公告)日： 2017-02-02
- 发明人: Terumasa Moriyama , Tomota Nagaura
- 申请人： JX Nippon Mining & Metals Corporation
- 优先权： JP2015-148174 20150727; JP2016-027039 20160216
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K3/46
摘要：
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
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