Invention Application
- Patent Title: SUBSTRATE CARRIER, A METHOD AND A PROCESSING DEVICE
- Patent Title (中): 基板载体，方法和处理装置
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Application No.: US14814559Application Date: 2015-07-31
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Publication No.: US20170032992A1Publication Date: 2017-02-02
- Inventor: Tobias Hoechbauer
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/673
- IPC: H01L21/673 ; C23C16/458 ; C23C16/46 ; H01L21/677 ; C23C16/455
Abstract:
A substrate carrier may include: a carrier plate including a plurality of substrate receiving regions; each substrate receiving region may include at least one first recess portion having a first depth and at least one second recess portion having a second depth, the second depth being greater than the first depth; and a carrier plate mounting structure configured to support the carrier plate.
Information query
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