发明申请
US20170040286A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
半导体器件，半导体封装和制造半导体器件的方法
- 专利标题： SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件，半导体封装和制造半导体器件的方法
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申请号： US15297948申请日： 2016-10-19
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公开(公告)号： US20170040286A1公开(公告)日： 2017-02-09
- 发明人: Jing-En LUAN
- 申请人： STMICROELECTRONICS PTE LTD
- 优先权： CN2014108545533 20141231
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L21/78 ; H01L23/495 ; H01L23/29
摘要：
Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.
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