Invention Application
- Patent Title: SMALL FORM-FACTOR MODULAR PLUGS WITH LOW-PROFILE SURFACE MOUNTED PRINTED CIRCUIT BOARD PLUG BLADES
- Patent Title (中): 低表面贴装印刷电路板插头片的小型模块式插头
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Application No.: US15333228Application Date: 2016-10-25
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Publication No.: US20170040762A1Publication Date: 2017-02-09
- Inventor: Richard A. Schumacher , Scott Lynn Michaelis
- Applicant: CommScope, Inc. of North Carolina
- Main IPC: H01R24/64
- IPC: H01R24/64 ; H01R13/6466 ; H05K1/11 ; H01R13/66 ; H01R24/28 ; H01R12/53 ; H01R13/6469
Abstract:
Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.
Public/Granted literature
- US09819131B2 RJ-45 communication plug with plug blades received in apertures in a front edge of a printed circuit board Public/Granted day:2017-11-14
Information query
