The present disclosure is drawn to electrocaloric heating and cooling devices and related methods. The electrocaloric heating and cooling devices can comprise an electronic feature of an integrated circuit, wherein the electronic feature is for heating and cooling cycles. The device can also include an electrocaloric film in thermal communication with the electronic feature which includes a blend or solid solution of two or more components selected from the group consisting of BNT, BKT, BZT, BMgT, and BNiT. Electrodes can be associated with the electrocaloric film, and an electrical source can be to add or reduce electrical field between the electrodes across the electrocaloric film to influence both heating and cooling of the electronic feature.