Invention Application
US20170044010A1 SENSOR ELEMENT, METHOD FOR MANUFACTURING SENSOR ELEMENT, DETECTION DEVICE, AND METHOD FOR MANUFACTURING DETECTION DEVICE
审中-公开
传感器元件，制造传感器元件的方法，检测装置和制造检测装置的方法
- Patent Title: SENSOR ELEMENT, METHOD FOR MANUFACTURING SENSOR ELEMENT, DETECTION DEVICE, AND METHOD FOR MANUFACTURING DETECTION DEVICE
- Patent Title (中): 传感器元件，制造传感器元件的方法，检测装置和制造检测装置的方法
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Application No.: US15118686Application Date: 2015-03-31
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Publication No.: US20170044010A1Publication Date: 2017-02-16
- Inventor: Tomoya HIRATA , Taiki NAKANISHI , Hiromoto INOUE , Yoshitatsu KAWAMA
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Priority: JP2014-076039 20140402
- International Application: PCT/JP2015/060135 WO 20150331
- Main IPC: B81C1/00
- IPC: B81C1/00 ; G01F1/692 ; B81B3/00
Abstract:
There is provided a sensor element including: a semiconductor base member having a first main surface and a second main surface located opposite to the first main surface, and having a cavity structure formed on the second main surface side; and a detection element formed on the first main surface side in a region where the cavity structure is formed, the second main surface of the semiconductor base member including a convexly and concavely shaped portion, and a tip of a convex portion of the convexly and concavely shaped portion having a curved shape.
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