Invention Application
- Patent Title: LASER CUTTING HEAD AND LASER CUTTING SYSTEM
- Patent Title (中): 激光切割头和激光切割系统
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Application No.: US15118858Application Date: 2015-02-24
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Publication No.: US20170050267A1Publication Date: 2017-02-23
- Inventor: YIHENG KUNG , YASUSHI MUKAI , WATARU TAKAHASHI
- Applicant: Panasonic Intellectual Property Management Co., Ltd
- Priority: JP2014-033760 20140225
- International Application: PCT/JP2015/000895 WO 20150224
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/70 ; B23K26/38

Abstract:
The laser processing head of the present disclosure includes a collimation lens, a focus lens, a first parallel plate, a first drive unit, a second parallel plate, and a second drive unit. The collimation lens collimates a laser beam having a first optical axis, and the focus lens condenses the collimated laser beam. The first parallel plate shifts the optical axis of the condensed laser beam to a second optical axis. The first drive unit rotates the first parallel plate around a first rotation axis. The second parallel plate shifts the optical axis of the laser beam shifted to the second optical axis, to a third optical axis. The second drive unit rotates the second parallel plate around a second rotation axis. The direction of the first rotation axis and the direction of the second rotation axis are identical.
Public/Granted literature
- US09889522B2 Laser processing system Public/Granted day:2018-02-13
Information query
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