Invention Application
- Patent Title: PIEZOELECTRIC PRINTHEAD ASSEMBLY
- Patent Title (中): 压电印刷机组件
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Application No.: US15307091Application Date: 2014-04-30
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Publication No.: US20170050438A1Publication Date: 2017-02-23
- Inventor: Peter J Fricke , Andrew L Van Brocklin
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2014/036005 WO 20140430
- Main IPC: B41J2/14
- IPC: B41J2/14
Abstract:
A piezoelectric printhead assembly can include a plurality of piezoelectric micro-electro mechanical system (MEMS) dies each having a first application-specific integrated circuit (ASIC) die coupled to a respective piezoelectric MEMS die and a second ASIC die coupled to the respective piezoelectric MEMS die.
Public/Granted literature
- US09776404B2 Piezoelectric printhead assembly Public/Granted day:2017-10-03
Information query
IPC分类:
