Invention Application
- Patent Title: Interconnection System for Panel Assemblies
- Patent Title (中): 面板组件互连系统
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Application No.: US15346205Application Date: 2016-11-08
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Publication No.: US20170051503A1Publication Date: 2017-02-23
- Inventor: Ramon Kalinowski
- Applicant: AAR Manufacturing, Inc.
- Main IPC: E04B2/72
- IPC: E04B2/72 ; E04B1/343 ; E04B1/41

Abstract:
A system for interconnecting multiple panel assemblies comprising a first bracketing body having a first bearing member and at least one planar member; a second bracketing body having a second bearing member pivotally engaged with the first bearing member and at least one planar member; a third bracketing body having at least one planar member; a fourth bracketing body having at least one planar member; a first panel receiving volume at least partially defined by the at least one planar member of the first and third bracketing bodies; a second panel receiving volume at least partially defined by the at least one planar members of the second and fourth bracketing bodies; and wherein the at least one planar members of the second and fourth bracketing bodies at least Partially define a second panel receiving volume. According to another aspect of the present invention, a first thermal insulating body is positioned between and separates the first and third bracketing bodies, and a second thermal insulating body positioned between and separates the second and fourth bracketing bodies. According to yet another aspect of the present invention, a fastenerless connection is provided between surfaces of the system and the panel assemblies.
Public/Granted literature
- US09988811B2 Interconnection system for panel assemblies Public/Granted day:2018-06-05
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