Invention Application
US20170054016A1 Semiconductor Device and Method of Manufacturing Semiconductor Device
审中-公开
半导体器件及制造半导体器件的方法
- Patent Title: Semiconductor Device and Method of Manufacturing Semiconductor Device
- Patent Title (中): 半导体器件及制造半导体器件的方法
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Application No.: US15340956Application Date: 2016-11-01
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Publication No.: US20170054016A1Publication Date: 2017-02-23
- Inventor: Shinichi MIYAKE , Tatsuo NAKAYAMA
- Applicant: Renesas Electronics Corporation
- Priority: JP2014-249833 20141210
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor device includes a buffer layer, a channel layer, a barrier layer, and agate electrode over a substrate, the gate electrode being disposed in a first opening with agate insulating film in between, the first opening running up to the middle of the channel layer through the barrier layer. The concentration of two-dimensional electron gas in a first region on either side of a second opening that will have a channel is controlled to be lower than the concentration of two-dimensional electron gas in a second region between an end of the first region and a source or drain electrode. The concentration of the two-dimensional electron gas in the first region is thus decreased, thereby the conduction band-raising effect of polarization charge is prevented from being reduced. This prevents a decrease in threshold potential, and thus improves normally-off operability.
Public/Granted literature
- US09837524B2 Semiconductor device and method of manufacturing semiconductor device Public/Granted day:2017-12-05
Information query
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