A polishing apparatus includes a jig unit including a substrate supporting part having a placing surface on which a substrate having a first curvature is placed. The placing surface has a second curvature corresponding to the first curvature and a polishing unit includes at least one polishing part to be rotated to polish a process surface of the substrate. The process surface of the curved substrate may be uniformly polished and foreign substances generated during the polishing process are prevented from entering into the substrate.