An apparatus, such as a pixel sensor for an ultrasonic imaging apparatus, is disclosed. The apparatus includes a first metallization layer coupled to a piezoelectric layer, wherein a first voltage is formed at the first metallization layer in response to an ultrasonic wave reflecting off an item-to-be-imaged (e.g., a user's fingerprint) and propagating through the piezoelectric layer, and wherein the first metallization layer is situated above a substrate; a second metallization layer situated between the first metallization layer and the substrate; and a device configured to apply a second voltage to the second metallization layer to reduce a parasitic capacitance between the first metallization layer and the substrate.