发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US15340785申请日： 2016-11-01
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公开(公告)号： US20170062372A1公开(公告)日： 2017-03-02
- 发明人: Jong Sik Paek , Doo Hyun Park
- 申请人： Amkor Technology, Inc.
- 优先权： KR10-2014-0012762 20140204
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L21/56
摘要：
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.
公开/授权文献
- US10032740B2 Semiconductor device and manufacturing method thereof 公开/授权日：2018-07-24
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