Invention Application
US20170065260A1 ULTRASONIC MODULE, ULTRASONIC APPARATUS, AND METHOD OF CONTROLLING ULTRASONIC MODULE
审中-公开
超声波模块,超声波设备及超声波模块的控制方法
- Patent Title: ULTRASONIC MODULE, ULTRASONIC APPARATUS, AND METHOD OF CONTROLLING ULTRASONIC MODULE
- Patent Title (中): 超声波模块,超声波设备及超声波模块的控制方法
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Application No.: US15253082Application Date: 2016-08-31
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Publication No.: US20170065260A1Publication Date: 2017-03-09
- Inventor: Yoshio ARAI , Kenji MURAKAMI
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-177319 20150909
- Main IPC: A61B8/00
- IPC: A61B8/00 ; A61B8/08 ; G01S7/52

Abstract:
An ultrasonic module includes a reception circuit adapted to receive a reception signal from an ultrasonic device, which receives an ultrasonic wave, to generate an echo signal, switching power supplies driven with a predetermined switching cycle, and adapted to supply the reception circuit with electrical power, and a phasing addition circuit adapted to perform an addition process on a first echo signal output when driving the reception circuit at a first drive timing in the switching cycle, and a second echo signal output when driving the reception circuit at a second drive timing delayed as much as a half cycle of a switching noise in the switching power supplies from the first drive timing.
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