Invention Application
- Patent Title: METHOD AND APPARATUS FOR PERFORMING PAYMENT
- Patent Title (中): 执行付款的方法和装置
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Application No.: US15259609Application Date: 2016-09-08
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Publication No.: US20170068953A1Publication Date: 2017-03-09
- Inventor: Eun Jik KIM , Heegyu JIN , Sridhar Rajiv KAVURI , Janghyuk KIM , Cholseo PARK
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2015-0158476 20151111
- Main IPC: G06Q20/38
- IPC: G06Q20/38 ; G06Q20/32 ; G06Q20/10

Abstract:
An electronic device and a method of payment are provided. The electronic device includes a secure module capable of storing at least one token, a first communication module, a second communication module, and at least one processor functionally or operatively connecting the secure module, the first and second communication modules to each other. The at least one processor is configured to control for determining at least one of the first and second communication modules as a communication module for performing a payment, and transmitting payment information containing a token related to the at least one of the first and second communication modules, from among the at least one token, to an external electronic device.
Public/Granted literature
- US10546291B2 Method and apparatus for performing payment Public/Granted day:2020-01-28
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