Invention Application
- Patent Title: MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Patent Title (中): 多层电子元件和板
-
Application No.: US15065932Application Date: 2016-03-10
-
Publication No.: US20170069437A1Publication Date: 2017-03-09
- Inventor: In Wha JEONG , Jae Suk SUNG , Hugh KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0125669 20150904
- Main IPC: H01G15/00
- IPC: H01G15/00 ; H01G7/06 ; H05K1/18 ; H01G4/30

Abstract:
A multilayer electronic component includes a ceramic body having stacked dielectric layers to form a first capacitor part and a second capacitor part, wherein the first capacitor has a constant capacitance, and the second capacitor part has a variable capacitance; a voltage control terminal formed on a lateral surface of the ceramic body; an input terminal disposed on another lateral surface of the ceramic body corresponding to the first capacitor part; and an output terminal disposed on the other lateral surface of the ceramic body corresponding to the second capacitor part separate from the input terminal.
Public/Granted literature
- US10062523B2 Multilayer electronic component and board having the same Public/Granted day:2018-08-28
Information query