FINFET DEVICE AND FABRICATING METHOD THEREOF

Invention Application

US20170069757A1 FINFET DEVICE AND FABRICATING METHOD THEREOF 审中-公开

Title translation: FINFET器件及其制造方法

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Patent Title: FINFET DEVICE AND FABRICATING METHOD THEREOF
Patent Title (中): FINFET器件及其制造方法
Application No.: US14994057

Application Date: 2016-01-12
Publication No.: US20170069757A1

Publication Date: 2017-03-09
Inventor: Yen-Ming Peng , Chi-Wen Liu , Hsin-Chieh Huang , Yi-Ju Hsu , Horng-Huei Tseng
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Main IPC: H01L29/78
IPC: H01L29/78 ; H01L29/66 ; H01L29/49 ; H01L29/423

FINFET DEVICE AND FABRICATING METHOD THEREOF

Abstract:

A FinFET device includes a substrate, a fin formed on the substrate, and a gate electrode crossing the fin. The gate electrode includes a head portion and a tail portion, and the tail portion is connected to the head portion and extended toward the substrate. The width of the head portion is greater than that of the tail portion.

Abstract(Chinese):

FinFET器件包括衬底，形成在衬底上的鳍片和与鳍片交叉的栅极电极。栅电极包括头部和尾部，尾部连接到头部并朝向衬底延伸。头部的宽度大于尾部的宽度。

Public/Granted literature

US10164059B2 FinFET device and fabricating method thereof Public/Granted day:2018-12-25

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/76	...单极器件
H01L29/772	....场效应晶体管
H01L29/78	.....由绝缘栅产生场效应的