In one embodiment, first and second circuit boards may be coupled together. The first circuit board may include a first trace to electrically couple a first integrated circuit to a first via of the first circuit board. In turn, the second circuit board may include a second trace to electrically couple a first contact of a first memory socket adapted to the first circuit board and a first contact of a second memory socket adapted to the first circuit board. This second trace, when the circuit boards are coupled together, is to electrically couple to a first via of the second circuit board, to enable the first via of the second board to electrically couple to the first via of the first circuit board. Other embodiments are described and claimed.