Invention Application
US20170079165A1 MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME 审中-公开
模块化的机架式冷却组件及其组装方法

  • Patent Title: MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME
  • Patent Title (中): 模块化的机架式冷却组件及其组装方法
  • Application No.: US15362487
    Application Date: 2016-11-28
  • Publication No.: US20170079165A1
    Publication Date: 2017-03-16
  • Inventor: Earl KeislingJohn CostakisGerald McDonnell
  • Applicant: Inertech IP LLC
  • Main IPC: H05K7/20
  • IPC: H05K7/20
MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME
Abstract:
A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.
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