- 专利标题: ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
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申请号: US15364749申请日: 2016-11-30
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公开(公告)号: US20170084381A1公开(公告)日: 2017-03-23
- 发明人: Shinichi SAKAMOTO , Zhigang CHENG , Fernando Chan Mock , Mitsugu KAWARAI
- 申请人: SUMIDA CORPORATION
- 优先权: CN201310109345.6 20130329; CN201410050474.7 20140213
- 主分类号: H01F27/28
- IPC分类号: H01F27/28 ; H01F27/24 ; H01F41/02 ; H01F41/061 ; H01F27/29 ; H01F27/30
摘要:
An electronic component includes a magnetic core member, a winding and a magnetic exterior body. The magnetic core member has a flat base and a core. The flat base has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface. The core is located on the top surface of the flat base. A winding has an edgewise coil and two non-wound flat wires that extend from the edgewise coil. A magnetic exterior body covers at least the core and the edgewise coil. The two non-wound flat wires continuously extend along the top surface, the first side surface, the bottom surface and the second side surface of the flat base in this order. The two non-wound flat wires located on the bottom surface work as electrodes.
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