- 专利标题: PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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申请号: US15092043申请日: 2016-04-06
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公开(公告)号: US20170086299A1公开(公告)日: 2017-03-23
- 发明人: Myung-Sam KANG , Sam-Dae PARK , Tae-Hong MIN , Il-Jong SEO , Young-Gwan KO
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2015-0133372 20150921
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K1/02 ; H05K1/11 ; H05K3/46 ; H05K3/06 ; H01G4/008 ; H01G4/12 ; H05K3/40 ; H05K1/03 ; H05K1/09
摘要:
A printed circuit board and a method for manufacturing the same are provided. A printed circuit board according to an example includes a core formed by laminating dielectric substance layers; a capacitor including an internal electrode layer formed between the dielectric substance layers which are adjacent with each other and a connection via alternately connecting the internal electrode layers which are adjacent with each other to provide an electric charge having a different polarity to the internal electrode layers which are adjacent with each other and formed on the core; and a through via passing through the core.
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