- 专利标题: Semiconductor Device Load Terminal
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申请号: US15285250申请日: 2016-10-04
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公开(公告)号: US20170098620A1公开(公告)日: 2017-04-06
- 发明人: Roman Roth , Wolfgang Wagner
- 申请人: Infineon Technologies AG
- 优先权: DE102015219183.4 20151005
- 主分类号: H01L23/00
- IPC分类号: H01L23/00
摘要:
A semiconductor device is presented. The semiconductor device comprises a semiconductor body coupled to a first load terminal and to a second load terminal and configured to carry a load current between the first load terminal and the second load terminal. The first load terminal comprises a contiguous metal layer coupled to the semiconductor body; and at least one metal island arranged on top of and in contact with the contiguous metal layer and configured to be contacted by an end of a bond wire and to receive at least a part of the load current by means of the bond wire, wherein the contiguous metal layer and the metal island are composed of the same metal.
公开/授权文献
- US10756035B2 Semiconductor device load terminal 公开/授权日:2020-08-25